This podcast from WhatIs.com explores what 3-D chips are, how they’re made and what their production might mean for the extension of Moore’s Law into the third dimension. In April 2007, a new version of 3-D chips was announced by a partnership of IBM and Rensselaer Polytechnic Institute (RPI) researchers at the IBM T.J. Watson Research Center, with support from the Defense Advanced Research Project Agency ( DARPA).

To learn more about the advance, we went right to the source and called up Kerry Bernstein. Kerry is a Senior Technical Staff Member at the IBM T.J. Watson Research Center, Yorktown Hts, NY. Kerry was kind enough to sit down with WhatIs.com’s Alex Howard to talk about IBM’s development of through-silicon vias, 3-D chips and the future of microprocessors.

 

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This podcast tells the story of Chester F. Carlson, the inventor of xerography. From his early days as a patent lawyer to the application of the electroconductive theory, Carlson worked an entire career to bring the photocopier to the world.

 

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